| BP |
Markéta Klimtová: Evaluation of Anisotropy of Structures Prepared by Additive Manufacturing (PDF) | Veselý Petr |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Roman Marko: Mechanical properties of solder joints (PDF) | Veselý Petr |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Oleksandr Chmel: Realization of Temperature-adjustable Closed Box for 3D Printer (PDF) | Veselý Petr |
2021 |
EEM |
Elektrotechnika a management |
| BP |
Jan Kopáčik: Reliability Tests of Solder Joints (PDF) | Veselý Petr |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Anna Kadlecová: Thermal Analysis of Low-Temperature Lead-Free Solder Alloy (PDF) | Veselý Petr |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Filip Holý: Electrically Conductive Polymers for 3D Printing (PDF) | Veselý Petr |
2022 |
EEM |
Elektrotechnika a management |
| BP |
Angelika Staňková: Solder joints quality evaluation based on soldering oven settings (PDF) | Veselý Petr |
2021 |
EEM |
Elektrotechnika a management |
| BP |
Jakub Zdráhal: Ecological Production of Printed Circuit Boards (PDF) | Veselý Petr |
2023 |
EEM |
Elektrotechnika a management |
| DP |
Matěj Vácha: Degradation of 3D Printed Structures due to Climatic Conditions (PDF) | Veselý Petr |
2024 |
EEM |
Elektrické pohony |
| BP |
Jindřich Bareš: Additive Manufacturing Technologies (PDF) | Veselý Petr |
2020 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Jan Půlpán: Electrical Properties of Photopolymers Designated for 3D printing (PDF) | Veselý Petr |
2020 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Matěj Vácha: Composite Materials Designated for 3D Printing (PDF) | Veselý Petr |
2021 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Sándor Ádám: Evaluation of properties of printed objects based on 3D printer settings (PDF) | Veselý Petr |
2019 |
EEM |
Aplikovaná elektrotechnika |
| DP |
Markéta Klimtová: Study of Electrochemical Migration on Surface of Printed Circuit Boards (PDF) | Veselý Petr |
2022 |
EEM |
Technologické systémy |
| DP |
Anna Kadlecová: Reliability Analysis of Solder Joints with Respect to Type of Component Lead and Type of Support Substrate (PDF) | Veselý Petr |
2022 |
EEM |
Technologické systémy |
| DP |
Jan Kopáčik: Effect of Flux on Intermetallic Layers Growth within Solder Joint (PDF) | Veselý Petr |
2022 |
EEM |
Technologické systémy |
| DP |
Jan Půlpán: Design and Practical Realization of High-Voltage Bushing Condenser with Use of 3D Printing (PDF) | Veselý Petr |
2023 |
EEM |
Technologické systémy |
