| BP |
Tomek Jakub: Behavior of ferrofluid in forced circulation | Dušek Karel |
2013 |
EEM |
Elektrotechnika a management (bakalářský) |
| BP |
Slavata Michal: Possible errors and control methods in the electronics assembly (PDF) | Dušek Karel |
2014 |
EEM |
Elektrotechnika a management |
| BP |
Veselý Petr: Risk analysis of soldering chips (PDF) | Dušek Karel |
2015 |
EEM |
Elektrotechnika a management |
| BP |
Froš Denis: Evaluation of the cleaning process for reflow soldering technology (PDF) | Dušek Karel |
2017 |
EEM |
Elektrotechnika a management |
| BP |
Hintermüller Jan: Influence of reflow soldering temperature profile on the formation of intermetallic layer (PDF) | Dušek Karel |
2018 |
EEM |
Elektrotechnika a management |
| BP |
Zbyněk Plachý: The issue of surface mount technology - the influence of moisture (PDF) | Dušek Karel |
2019 |
EEM |
Elektrotechnika a management |
| BP |
Iva Králová: Solderability measurement by wetting balance test (PDF) | Dušek Karel |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Marek Teringl: Voids inside solder joints (PDF) | Dušek Karel |
2020 |
EEM |
Elektrotechnika a management |
| BP |
Baudyš Dominik: Reliability of vias in printed circuit boards during soldering reflow (PDF) | Dušek Karel |
2018 |
EEM |
Elektrotechnika a management |
| BP |
Adam Kubín: Wires dimensioning for passenger cars (PDF) | Dušek Karel |
2019 |
EEM |
Elektrotechnika a management |
| BP |
Pavel Procházka: The process of re-tinning component leads (PDF) | Dušek Karel |
2024 |
EEM |
Elektrotechnika a management |
| DP |
Umlauf Jan: Quantify quality parameters during conformal coating process of printed circuit board (PDF) | Dušek Karel |
2015 |
EEM |
Elektroenergetika |
| BP |
Zeidler Marek: Degradation of solder pastes | Dušek Karel |
2012 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Vlach Jan: Study of voids in solder joints | Dušek Karel |
2012 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Růžička Daniel: Solderability measurement with wetting balance method | Dušek Karel |
2012 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Vávra Jan: Study of solder spread | Dušek Karel |
2012 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Straka Václav: Solder joints - tombstone effect | Dušek Karel |
2012 |
EI |
Silnoproudá elektrotechnika (bakalářský) |
| BP |
Dvořáková Klára: Solderability measurement of lead free solders | Dušek Karel |
2013 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Mikula Tomáš: Influence of temperature profile on voids formation inside solder joints | Dušek Karel |
2013 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Shamshiden Nursultan: Study of whisker growth on the PCB | Dušek Karel |
2014 |
EEM |
Aplikovaná elektrotechnika (bakalářský) |
| BP |
Moc Vladimír: Study of transformer heating (PDF) | Dušek Karel |
2015 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Zahradník Vít: Study of the effect of latent heat in reflow soldering (PDF) | Dušek Karel |
2015 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Husák Jiří: Solderability measurement by wetting balance method in vapor pressure (PDF) | Dušek Karel |
2015 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Moc Vladimír: Study of transformer heating (PDF) | Dušek Karel |
2015 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Kozák Martin: Influence of surface finishes on voids formation inside the solder joints (PDF) | Dušek Karel |
2016 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Kulhavý Jan: Study of dendritic growth on printed circuit board (PDF) | Dušek Karel |
2017 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Durst Pavel: Workplace for testing of dendritic growth (PDF) | Dušek Karel |
2017 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Renza Ondřej: Temperature profile, growth of intermetallic layers (PDF) | Dušek Karel |
2018 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Radim Ille: Influence of vias on thermomechanical properties of printed circuit boards (PDF) | Dušek Karel |
2020 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Němeček Nickolas: Voids analysis inside the solder joints (PDF) | Dušek Karel |
2018 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Daniel Koc: Analysis of thermomechanical properties of printed circuit boards (PDF) | Dušek Karel |
2022 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Vojtěch Polena: The influence of the production process on the properties of LED light fixture (PDF) | Dušek Karel |
2024 |
EEM |
Aplikovaná elektrotechnika |
| BP |
Miroslav Menšík: Analysis of surface finish properties of soldering pads (PDF) | Dušek Karel |
2024 |
EEM |
Aplikovaná elektrotechnika |
| DP |
Novák Michal: Image analysis use for the evaluation of the components offset and solders spreading | Dušek Karel |
2011 |
EEM |
Technologické systémy |
| DP |
Náhlík Vojtěch: Testing of fluxes aggressivity | Dušek Karel |
2012 |
EEM |
Technologické systémy |
| DP |
Růžička Daniel: Study of the influence of flux amount on the occurrence of voids in solder joints (PDF) | Dušek Karel |
2014 |
EEM |
Technologické systémy |
| DP |
Vávra Jan: Study of whisker growth (PDF) | Dušek Karel |
2014 |
EEM |
Technologické systémy |
| DP |
Čepek Martin: Mechanical properties of ultrasonic-assisted soldering joints (PDF) | Dušek Karel |
2016 |
EEM |
Technologické systémy |
| DP |
Novák Ondřej: Solder joints, growth of dendrites (PDF) | Dušek Karel |
2016 |
EEM |
Technologické systémy |
| DP |
Beran Tomáš: Thermo-mechanical tests of solder joints (PDF) | Dušek Karel |
2016 |
EEM |
Technologické systémy |
| DP |
Veselý Petr: Preparing and design of experiment for the flux sputtering analysis from solder paste (PDF) | Dušek Karel |
2017 |
EEM |
Technologické systémy |
| DP |
Zahradník Vít: Monitoring of solder alloys behaviour by latent heat measurement (PDF) | Dušek Karel |
2017 |
EEM |
Technologické systémy |
| DP |
Ševčík Jan: Reliability of vias of printed circuit boards (PDF) | Dušek Karel |
2018 |
EEM |
Technologické systémy |
| DP |
Dominik Baudyš: Study of Printed Circuit Board Properties (PDF) | Dušek Karel |
2020 |
EEM |
Technologické systémy |
| DP |
Petráč Adam: Influence of flux on intermetallic layer thickness in solder joints (PDF) | Dušek Karel |
2018 |
EEM |
Technologické systémy |
| DP |
Zbyněk Plachý: Underfilled components for surface mount technology - study of properties (PDF) | Dušek Karel |
2021 |
EEM |
Technologické systémy |
| DP |
Denis Froš: Thermomechanical tests of soldering pads (PDF) | Dušek Karel |
2019 |
EEM |
Technologické systémy |
| DP |
Jan Hintermüller: Study of whiskers growth from solder joints (PDF) | Dušek Karel |
2020 |
EEM |
Technologické systémy |
| DP |
Marek Teringl: Study of void formation in lead-free soldering (PDF) | Dušek Karel |
2022 |
EEM |
Technologické systémy |
| DP |
Jan Kulhavý: Voids inside solder joints (PDF) | Dušek Karel |
2019 |
EEM |
Technologické systémy |
| DP |
Kozák Martin: Study of influence of surface finishes of soldering pads on voids formation inside solder joints (PDF) | Dušek Karel |
2018 |
EEM |
Technologické systémy |
| DP |
Jakub Slavata: Study of intermetallic layers growth (PDF) | Dušek Karel |
2021 |
EEM |
Technologické systémy |
| DP |
Iva Králová: Testing of lead-free alloys solderability by the wetting balance method (PDF) | Dušek Karel |
2022 |
EEM |
Technologické systémy |
| DP |
Jakub Mareš: Problematics of conductive paths deposition on substrates (PDF) | Dušek Karel |
2022 |
EEM |
Technologické systémy |
| DP |
Tomáš Hančl: Assessment of component leads quality for soldering technology (PDF) | Dušek Karel |
2024 |
EEM |
Technologické systémy |
| DP |
Daniel Koc: Assessment of solder pastes from the perspective of expiration (PDF) | Dušek Karel |
2024 |
EEM |
Technologické systémy |
| DP |
Zíma Michal: Interactive Management System for SEO evaluation | Dušek Karel |
2014 |
OI |
Softwarové inženýrství |
| BP |
Petr Beneš: Wave Soldering - Study of Process Parameters (PDF) | Dušek Karel |
2023 |
EK |
|
| BP |
Šiler Antonín: Design and realization of the equipment for desoldering SMT component from PCB | Dušek Karel |
2011 |
EI |
Kybernetika a měření (bakalářský) |
|
Martin Plaček: Monitoring the lead-free solder joint properties (PDF) | Dušek Karel |
2019 |
|
Elektrotechnologie a materiály |
|
Petr Veselý: Influence of solder flux on quality of surface mount technology (PDF) | Dušek Karel |
2021 |
|
Elektrotechnologie a materiály |
|
Denis Froš: Effects of thermal stress on properties of printed circuit boards (PDF) | Dušek Karel |
2024 |
|
Elektronika a měřicí technika |
|
Martin Kozák: Viods in Solder Joints (PDF) | Dušek Karel |
2024 |
|
Elektrotechnologie a materiály |
